Senior SI/PI Engineer - HBM 5D/3D Packaging
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Engineering
Job Description & How to Apply Below
Micron Technology seeks a SI/PI Engineer in HBM Build Architecture to develop high-quality SI/PI analysis for interposers, packages, and silicon channels. You will contribute to HBM build sign-off and product success across multi-generation designs, including interposer channel analysis and PDN architecture.
You will apply time-domain and frequency-domain methods, work with EDA tools, and help drive sign-off processes, leveraging AI/ML to boost productivity.
This role, Senior SI/PI Engineer - HBM & 2.5D/3D Packaging at Micron, could be your next career step.
The Senior SI/PI Engineer - HBM & 2.5D/3D Packaging position in the IT & Technology, Engineering field is open for applications.
We have an opening for a Senior SI/PI Engineer - HBM & 2.5D/3D Packaging in Richardson, TX, United States within IT & Technology, Engineering.
This role, Senior SI/PI Engineer - HBM & 2.5D/3D Packaging at Micron, could be your next move.
Position Requirements
10+ Years work experience(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
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