HBM DFT Engineer — Tape Test Innovation

Micron Technology, Inc. seeks an Engineer – HBM Design for Test (DFT) to define, implement, integrate, and support DFT solutions across HBM cores and base dice for current and next-gen products.

The role drives defined DFT architectures, collaborates with multi-functional teams, and ensures DFT features meet test, quality, and manufacturability requirements, supporting tape-out, silicon bring‑up, and qualification.

We are looking to fill the HBM DFT Engineer — Tape-Out & Test Innovation position at Micron Technology, Inc. in Richardson, TX, United States.

We aim to respond to suitable candidates as soon as possible.

Full responsibilities and requirements are described in the listing above.

Learn more about the HBM DFT Engineer — Tape-Out & Test Innovation role in the description above.

We appreciate your interest in this position.

Join Micron Technology, Inc. and contribute to our ongoing work.