Intern - HIG HBM DTPCO

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever.

Within the HBM organization, our highly collaborative engineering teams advance next‑generation High Bandwidth Memory (HBM) solutions through device characterization, data analysis, modeling, and root‑cause investigation. The team partners across Design Technology Co‑Optimization (DTPCO), Product Engineering, Packaging, Test, Reliability, and Technology Development to drive product innovation and quality. In this internship, you will gain hands‑on experience analyzing semiconductor product and manufacturing data to understand device performance and chip‑package interactions.

You will work alongside engineers to execute silicon learning activities, investigate technical issues, and develop data‑driven solutions that improve engineering workflows. You will also have opportunities to apply automation, AI, Generative AI, and Agentic AI to engineering analysis and problem‑solving.

• Analyze probe, parametric, characterization, electrical, process, and manufacturing data to assess device health and identify trends, correlations, and potential root causes.
• Support engineering experiments, test vehicles, characterization activities, and silicon learning through data collection, analysis, documentation, and tracking.
• Perform cross-functional data correlation to evaluate interactions among semiconductor design, process technology, assembly/package, and electrical performance.
• Develop and improve automated data‑analysis, visualization, and correlation workflows using Python, JMP/JSL, SQL, or similar tools.
• Apply AI, Generative AI, and Agentic AI to improve engineering workflows, data analysis, test development, and problem‑solving efficiency.

• Currently enrolled in a Bachelor's degree program in Electrical Engineering, Computer Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Applied Physics, Computer Science, Data Science, or a related technical field.
• Expected to have completed sophomore year before the internship start date.
• Demonstrated foundational engineering knowledge through college coursework, laboratory experience, or at least one technical project.
• Experience using at least one programming or data‑analysis tool such as Python, MATLAB, Excel, JMP, SQL, or a similar platform.
• Experience using data visualization, plots, statistics, or other analytical methods to identify trends, relationships, or correlations in technical data.

• Coursework, laboratory experience, or technical project experience related to semiconductor devices, electronics, semiconductor manufacturing, electrical test, packaging, reliability, or product engineering.
• Experience using Python, JMP/JSL, SQL, MATLAB, or similar tools to automate data analysis, visualization, or engineering workflows.
• Experience applying statistical methods, data correlation, or root‑cause analysis to an engineering or technical problem.
• Experience Using AI, Generative AI, or Agentic AI in coursework, technical projects, data analysis, automation, or engineering problem‑solving.
• Demonstrated ability to communicate technical findings and collaborate effectively through laboratory assignments, team projects, research, internships, or other technical…