HBM SoC Physical Design Engineer — PPA Master

Micron Technology in Richardson, TX, seeks a SoC Physical Design Engineer to lead physical implementation from netlist to GDSII for advanced HBM/DRAM‑adjacent designs. You will work with RTL, verification, DFT, IP, packaging and manufacturing to optimize PPA and ensure robust tape-out.

Responsibilities include floor planning, placement, CTS, routing, clocking and signoff coordination, with a focus on power integrity and resistance to variations.

We are seeking a motivated HBM SoC Physical Design Engineer — PPA Master to join Micron Technology, Inc. in Richardson, TX, United States.

We would love to welcome a new HBM SoC Physical Design Engineer — PPA Master to our group in Richardson, TX, United States.

For the HBM SoC Physical Design Engineer — PPA Master position at Micron Technology, Inc., we are reviewing applications now.

Step into the HBM SoC Physical Design Engineer — PPA Master role at Micron Technology, Inc. in Richardson, TX, United States and grow with us.