Principal Mixed-Signal Architect — HBM​/DRAM Speed I​/O

Micron Technology, Inc. is seeking a senior/lead engineer to define and own mixed-signal architecture for HBM and DRAM subsystems.

You will drive performance, power, and scalability tradeoffs while leading pre-silicon validation and post-silicon bring-up across cross-functional teams. The role requires leadership in analog/mixed-signal design, clocking, and data path circuits, with collaboration across Digital, Physical, and Packaging disciplines to meet reliability targets and time-to-market

This is a genuine opening to take on the Principal Mixed-Signal Architect — HBM/DRAM & High-Speed I/O role at Micron Technology, Inc.

Our group is growing, and we are hiring a Principal Mixed-Signal Architect — HBM/DRAM & High-Speed I/O in Richardson, TX, United States.

This position is for the Principal Mixed-Signal Architect — HBM/DRAM & High-Speed I/O role at Micron Technology, Inc.

We are seeking a motivated Principal Mixed-Signal Architect — HBM/DRAM & High-Speed I/O to join Micron Technology, Inc. in Richardson, TX, United States.