Thermal Simulation Engineer HBM & 3D Packaging
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Engineering
Job Description & How to Apply Below
Micron Technology, Inc. is seeking an experienced MTS - Thermal Simulation Engineer to lead high-fidelity thermal and thermo-mechanical modeling for HBM products.
You will drive simulation strategy, mentor engineers, and coordinate across design, packaging, and test teams. The role requires strong background in heat transfer, FEM, and multiphysics tools, with a focus on silicon correlation and packaging technologies.
This role, Thermal Simulation Engineer for HBM & 3D Packaging at Micron Technology, Inc., could be your next career step.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Thermal Simulation Engineer for HBM & 3D Packaging role in the description above.
We appreciate your interest in this position.
Join Micron Technology, Inc. and contribute to our ongoing work.
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