HBM Core-Die Architect & DRAM Circuit Designer

Micron Technology, Inc. is seeking an HBM Core-Die Architecture & Circuit Design Engineer to own next-generation HBM core-die architecture and critical DRAM circuit design that impact bandwidth, power, and reliability.

You will drive architecture definition and ARD development across advanced 3D-stacked HBM products, enabling AI-enabled solutions and efficient data processing. As part of a world-leading semiconductor team, you will collaborate with multiple engineering groups to deliver

Join us at Micron Technology, Inc. as our next HBM Core-Die Architect & DRAM Circuit Designer in Richardson, TX, United States.

We are seeking a motivated HBM Core-Die Architect & DRAM Circuit Designer to join Micron Technology, Inc. in Richardson, TX, United States.

Consider building your career as a HBM Core-Die Architect & DRAM Circuit Designer at Micron Technology, Inc.

The HBM Core-Die Architect & DRAM Circuit Designer position in the IT & Technology, Engineering field is open for applications.