Interface Design Engineer, HBM

Position: Staff Interface Design Engineer, HBM
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Job Description We are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design, technology, and manufacturing to deliver next‑generation HBM solutions that power AI and ML workloads worldwide. Our team thrives on deep technical collaboration, global partnerships, and solving problems that truly push memory technology forward!

In this full‑time onsite role, you will provide critical technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups, helping translate advanced process capabilities into scalable, high‑performance architectures. Your work will directly impact performance, power efficiency, reliability, and long‑term HBM roadmap success. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making.

Responsibilities:

Job Description The responsibilities outlined below represent key areas of focus for this role and are intended to be illustrative rather than exhaustive.

Candidates are expected to demonstrate proven experience in at least three of the five focus areas outlined below.

Foundry Interface and Technology Alignment Circuit Simulation and Analysis Test-Chip and Silicon ValidationPDK and Design EnablementAI-Enabled Productivity and Efficiency Improvement

Minimum Qualifications BS, MS, or PhD or equivalent experience in Electrical Engineering, Computer Engineering, or related field.
6+ years of semiconductor industry experience and Solid understanding of advanced semiconductor technology development

Strong grasp of advanced CMOS technology nodes, FinFET devices, and process integration.

Hands-on experience with: HSPICE simulations, Device characterization, Standard cell benchmarking, PPA analysis, Parasitic extraction and physical verification

Experience in driving AI-enabled engineering practices and automation to improve the efficiency of DTCO analysis, foundry collateral evaluation, PDK enablement, benchmarking, and collaboration across build teams.

Preferred Qualifications Experience working directly with leading foundries such as TSMC, Samsung, Intel Foundry Services, or Global Foundries.

Experience with memory products including DRAM, HBM, or SRAM.Knowledge of: TSV technologies, Advanced packaging, Reliability modeling and aging simulations, Advanced BEOL technologies, PDK development and validation

Ability to apply AI tools to summarize, analyze, and extract insights from: PDK documentation, Design Rule Manuals (DRMs), Reliability reports, Foundry collateral, Silicon characterization data,Experience leading technology pathfinding and node selection activities.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

The US base salary range that Micron Technology estimates it could pay for this full-time position is:$ - $ a year Additional compensation may include benefits, bonuses and equity.

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and…