Senior SI/PI Engineer – HBM 5D/3D Packaging
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Engineering
Job Description & How to Apply Below
Micron Technology, Inc. is seeking an SI/PI Engineer in HBM Build Architecture to drive high-quality SI/PI analyses for interposers, packages, and silicon channels.
The role anchors HBM sign-off across multiple generations, focusing on signal quality, power delivery integrity, and interface reliability. You will contribute to PDN architecture, conduct time- and frequency-domain analyses, and collaborate with EDA vendors to improve tool accuracy and automation for AI-enabled decision making in
We invite applications for the Senior SI/PI Engineer – HBM & 2.5D/3D Packaging position located in Richardson, TX, United States.
This is an excellent role to take on the Senior SI/PI Engineer – HBM & 2.5D/3D Packaging role at Micron Technology, Inc.
As a Senior SI/PI Engineer – HBM & 2.5D/3D Packaging, you will play an important part at Micron Technology, Inc. in Richardson, TX, United States.
Position Requirements
10+ Years work experience(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
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