Senior .5D/3D Packaging Engineer – Hybrid Bonding & TSVs
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Engineering
Packaging Engineer, Manufacturing Engineer
Job Description & How to Apply Below
Apple’s Advanced Packaging team in the San Francisco Bay Area seeks an experienced Packaging Development Engineer to drive next‑generation 2.5D/3D packaging integration for future products. You will lead definition, development, and qualification of cutting‑edge packaging technologies including hybrid bonding, interposers, and TSVs.
The role requires coordination across silicon design, SI/PI, thermal, and manufacturing teams from concept through qualification and high‑volume manufacturing.
This role, Senior 2.5D/3D Packaging Engineer – Hybrid Bonding & TSVs at Apple, Inc., could be your next opportunity.
The position is based in CA, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 185..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Senior 2.5D/3D Packaging Engineer – Hybrid Bonding & TSVs role in the description above.
Position Requirements
10+ Years work experience(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
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