Senior Product Applications Engineer II

Regional technical authority for next-generation AI and HPC infrastructure, owning technical strategy, solution architecture, customer engagement, and ecosystem development for advanced liquid cooling technologies across hyperscale, enterprise AI, and HPC deployments. Recognized as a trusted technical advisor to consultants, hyperscalers, Specialized Data centre EPCs, engineering firms, and strategic customers covering full project technical lifecycle – from specification and technology selection to tendering, value engineering, Ecosystem upskilling and award.

• Act as regional technical authority for AI-ready DC infrastructure and liquid cooling; lead technical development of AI/HPC projects requiring high-density environments.
• Define/ Deploy reference architectures and best practices; establish technical governance for liquid cooling deployment; support executive leadership on technology strategy and competitive positioning.

• Direct-to-Chip (D2C), Rear Door Heat Exchangers (RDHx), Immersion Cooling, TCS and Secondary Network Heat (SFN) loops, CDU architecture & facility heat exchanger FWS design.
• Glycol/water loop engineering, hydraulic balancing, pumping systems, thermal management, heat rejection, water/ Mix Liquid quality management, facility hydraulic integration.
• Optimize air/liquid capture ratio, air-to-hybrid transition strategies, AI rack thermal management, high-density racks (>80–150+ kW/rack), thermal resilience, redundancy and energy efficiency.

• Lead design for AI Pods, GPU clusters, NVIDIA HGX/MGX, NVL platforms, large GPU clusters, HPC and AI Factory architectures, high-density white space.
• Rack architecture, containment, high-performance airflow, power distribution integration, 800
  
  VDC-ready infrastructure, busbar systems, AI-ready POD compute topology, mechanical-electrical integration.

• Support Sales, coach BD teams, enable Presales, influence consultants, engineering firms, EPC / DCS contractors, hyperscalers and AI ecosystem partners.
• Lead specification development, design reviews, technology positioning, competitive differentiation, customer workshops, executive presentations and design validation.

• Own the full technical tendering process: qualification, architecture validation, risk assessment, design optimization, compliance review, value/cost engineering, technical negotiations, bid defense, customer clarifications and final technical approvals through to award.

• Build trusted relationships with hyperscalers, enterprise customers, AI infrastructure providers, consultants, design institutes, EPC/mechanical contractors and channel partners.
• Represent the organization at executive workshops, industry conferences, technical seminars, customer advisory sessions and AI technology forums.

GPU infrastructure, HPC architecture, AI Factory design, large-scale AI clusters, rack density optimization, thermal management, AI-ready electrical infrastructure.

Tier III/IV architectures, white space & containment, precision cooling, chilled water, CRAH/CRAC, in-row cooling, RDHx, high-availability mechanical systems, mission-critical redundancy. DC infrastructure Digital Twin, Desing simulation, DCS Software stack

Direct Liquid Cooling & Immersion Cooling, TCS/SFN, CDU technologies, heat exchangers, hydraulic systems, pumping stations, thermal modeling/CFD, heat recovery concepts.

800

VDC technologies, High density Power train architecture, integrated Compute critical infrastructure…