Wiresaw Process Engineer - Wafer Slicing; Diamond Wire & Slurry

Location: United States, flexible (remote, near a major airport)

Travel: Approximately 75%, domestic and international

Compensation: $120,000 - $130,000 base

Most wafering engineers spend their careers tuning someone elses wire saw. This role puts you on the builders side of the machine.

Our client, a global manufacturer of precision equipment for wafer slicing, grinding, lapping, and polishing, serves semiconductor and advanced materials producers around the world. As their Wiresaw Process Engineer, you will be the subject matter expert for diamond-coated wire (DCW) and slurry wire slicing. You will run the process work that proves out their machines, take that knowledge into customer fabs, and bring what you learn back to shape the next generation of equipment.

If you know multi-wire sawing inside and out and want your expertise to influence product design, not just one production line, read on.

• Own wire slicing process development for DCW and slurry processes: cutting performance, wafer quality (TTV, bow, warp, surface damage), throughput, and wire and consumable usage
• Lead equipment startups, process qualifications, and FAT/SAT at customer sites worldwide, and act as the technical advisor through ramp and optimization
• Design and run DOEs, apply SPC, and turn test data into clear recommendations for customers and internal teams
• Lead root cause investigations on yield, quality, and downtime issues and put corrective actions in place that hold
• Feed field results back to engineering: tool design input, performance specs, and equipment enhancements
• Document process recipes, procedures, and findings, contribute to patents where it makes sense, and help build the teams wafering know-how

• Bachelors degree in Engineering, Materials Science, or a related technical field5+ years of process engineering in wafer slicing, ingot wafering, or related precision material removal
• Hands‑on experience with diamond‑coated wire and/or slurry multi‑wire saw processes, equipment, and consumables
• A track record of improving yield, quality, or throughput, backed by DOE, SPC, and structured root cause analysis
• Comfort working directly with customer engineering teams and presenting technical findings clearly
• Ability to work independently in the field, read technical drawings and specs, and make hands‑on equipment adjustments
• Willingness to travel about 75%, including internationally

• Wafering experience in silicon, silicon carbide (SiC), sapphire, solar/PV, rare earth magnets, advanced ceramics, or optics
• Background in applications engineering, field process support, or work at an equipment OEM
• Experience with wafer metrology and process characterization
• Advanced degree, or exposure to patents and new technology commercialization

This role is a strong fit if you enjoy being the person who gets called when a cut isnt running right, you like being on the road in front of customers, and you want to see your process knowledge built into the equipment itself. It is not a fit if you are looking for a fixed‑site, single‑fab role.

Salary Type :
Annual Salary

Salary Min : $ 120000

Salary Max : $ 130000

Currency Type : USD