Onsite Mechanical Design & Thermal Intern
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Engineering
Job Description & How to Apply Below
Hewlett Packard Enterprise Company is seeking a Mechanical Design Engineering Intern to join the Aruba Networking hardware R&D team in California. You will work on real-world projects involving mechanical design, thermal management, CAD modeling, and testing, gaining hands-on experience in evaluating concepts and validating prototypes.
You will learn to analyze thermal and mechanical performance, document results, and collaborate with cross-functional teams to drive design improvements in
This role, Onsite Mechanical Design & Thermal Intern at Hewlett Packard Enterprise Company, could be your next move.
All applications are reviewed carefully by our team.
The position is based in Roseville, CA, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 48.000 - 56.000.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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