Director of Engineering Speed Copper Technology

Own Infraeo’s full copper portfolio - passive DAC and active AEC/ACC - and build the U.S. engineering team behind it.

Infraeo Inc. is a global AI cluster connectivity company developing and licensing cutting-edge connectivity technologies and products. Our solutions help customers ship optical transceivers and cable assemblies with superior cost and performance, enabling 400G, 800G, and 1.6T AI cluster networking.

We provide engineering design, IP licensing, field engineering services, and logistics solutions to accelerate the deployment of AI infrastructure worldwide. With a global team across the US and Asia, we serve customers around the world.

The Director of Engineering, High-Speed Copper Technology owns Infraeo’s full copper portfolio - passive DAC and active AEC/ACC solutions - from technology strategy and product development through qualification, launch, production, and end-of-life.

This role carries both organizational and technical ownership. You will build and lead the U.S. engineering team, set the technology roadmap, own the technical relationship with our semiconductor partners, and be accountable for on‑time delivery of designs that meet performance, cost, and quality targets. Because our designs are licensed and transferred to customers and manufacturing partners rather than built in‑house, design‑for‑manufacturability, defensible IP, and clean technical transfer are core to the job - not downstream concerns.

The team is global, spanning the US and Asia, and the role requires working effectively across both. This position is based onsite at our Round Rock, TX office; it is not a remote or hybrid role.

• Manage the full portfolio of copper products, passive and active, across technology strategy, product development, qualification, launch, production, and lifecycle management.
• Lead research, development, and product strategy for high‑speed copper technologies and related solutions.
• Establish technology and product roadmaps aligned with business objectives, customer requirements, and industry standards.
• Monitor industry trends, technical standards, competitive developments, and emerging technologies, and translate them into portfolio direction.

• Manage and develop the U.S.
  
  -based engineering team responsible for firmware development and hardware design - setting technical priorities, allocating resources, mentoring team members, fostering cross‑functional collaboration, and ensuring timely delivery of high‑quality products.
• Own headcount planning, hiring, performance management, and career development for engineering, product‑development, firmware, hardware‑design, and other technical staff.
• Own the engineering budget, including tooling, test equipment, NRE, and third‑party design and validation spend.
• Collaborate with product management, manufacturing, quality, supply chain, sales, and major customers.

• Provide technical direction for signal integrity and transmission performance, thermal management, materials, components, active electronics, firmware, and board‑level architecture.
• Guide design validation, testing, qualification, reliability assessment, and product‑launch activities for passive and active copper products.
• Ensure all products meet applicable performance, reliability, cost, quality, manufacturing, and regulatory requirements.
• Own escalation and resolution of major technical issues across development and production.

• Manage all technical relationships with semiconductor partners from a new‑design perspective: evaluating and selecting semiconductor technologies, defining technical requirements, coordinating architecture and design…