AI Hardware Layout Engineer 5D/3D, Onsite
Listed on 2026-11-05
-
Engineering
Hardware Engineer, Electronics Engineer, Systems Engineer, Packaging Engineer
Acceler8 Talent in Mountain View, CA seeks a Package Layout Engineer to own the physical design of advanced semiconductor packages for AI accelerators, leading end-to-end substrate and interposer layouts from stackup definition to tapeout, in collaboration with silicon, SI/PI, and PCB teams.
Responsibilities include bump mapping, 2.5D/3D integration, high-density RDL routing, power/ground networks, and OSAT coordination to meet manufacturing requirements.
Join us at Acceler8 Talent as our next AI Hardware Package Layout Engineer - 2.5D/3D, Onsite in CA, United States.
We are seeking a motivated AI Hardware Package Layout Engineer - 2.5D/3D, Onsite to join Acceler8 Talent in CA, United States.
Consider building your career as a AI Hardware Package Layout Engineer - 2.5D/3D, Onsite at Acceler8 Talent.
The AI Hardware Package Layout Engineer - 2.5D/3D, Onsite position in the Engineering field is open for applications.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).