Senior Optical Packaging Engineer

Senior Optical Packaging Engineer

We turn light into insight!

Due to EXTENSIVE growth, we are currently looking for folks that share our passion to reveal the invisible!

As Senior Optical Packaging Engineer, you will oversee developing advanced packaging solutions including package design, material selections, fabrication processing, qualification, and documentation. You’ll work closely with design engineers, process engineers, supply chain, operations technicians, facilities, and outside consultants. Responsibilities include the development of advanced packaging solutions of photodiode devices, electronics, and micro-optics for various market segments. You will provide packaging solutions which meet demanding product requirements while balancing the need for reliability and cost.

You will follow the NPI gate process, ensure the products meet both internal and customer specifications as required, and that the product is designed for manufacturing. You will also be responsible for ensuring the repeatability and reproducibility of our products and make suggestions where applicable on next gen fabrication/assembly capabilities.

This full-time, exempt role will report to the COO, and will be located at our Salem, NH facility.

** Preference will be given to candidates within a COMMUTABLE DISTANCE to Salem, NH.

Responsibilities

• Perform all aspects of package design and verification through the NPI and engineering change process to deliver robust, manufacturable solutions. This will be achieved through full understanding of product performance, material implications, project costs and design for manufacture.

• Develop and document manufacturing techniques, materials, tools and processes related to back-end Photodiode assembly.

• Performs analyses and selects techniques to solve problems and enhance product yield and process flows.

• Establish high yielding, cost effective processes based on product need and customer requirements.

• Develops and executes Design of Experiments (DOE) for process optimization utilizing appropriate statistical analysis.

• Evaluates and validates process and design alternatives based on product manufacturability.

• Perform technical leadership to a manufacturing engineer to drive a new product or process into manufacturing.

• Provides processes that are robust and repeatable against product specifications and that support the quoted cost.

• Lead the design and manufacturing team in the direction for improving and streamlining existing processes for increased package assembly quality and reduced assembly time.

• Mentor junior staff.

• Other duties as assigned by your manager

Experience

• BS in mechanical engineering, material science, or closely related technical discipline with at least 8 years of industrial experience in semiconductor or photonics die packaging.

• Fluent with material properties, packaging techniques, and manufacturing disciplines including die attach methods, wire bonding, flip chip die attach, seam seal, laser mark, and related qualification techniques.

• Demonstrated experience of working with diverse engineering disciplines.

• Strong manufacturing experience which insures high yield along with controlled process.

Preferred Experience

• MSME with 6+ years of direct semiconductor or photonics die packaging experience.

• 5 years plus of technical leadership experience in cross-functional teams.

• Design for Six Sigma practices including Root Cause Analysis, Design of Experiments, etc.

• General awareness of FEA-based analysis techniques as related to photonics and PIC package designs would be distinct advantage.

MISC:

• Able to lift up to 20lbs

• Travel may be required, likely less than 10%

• Wear complete fab attire for an entire shift and meet all safety and cleanroom…