Lead Packaging Plating & Module Engineer
Listed on 2026-10-30
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Engineering
Process Engineer, Packaging Engineer, Manufacturing Engineer, Quality Engineering
Intel Corporation in Hillsboro, Oregon is seeking a Module Development Engineer to advance semiconductor manufacturing capabilities by developing and optimizing processes for next-generation devices, conducting feasibility studies, and enabling high-volume production.
You will collaborate across teams, use SPC and data analytics, and drive process innovations, with a Master's/PhD plus 2–4 years in semiconductor processing; on-site work model.
We have an opening for a Lead Packaging Plating & Module Engineer in OR, United States within Engineering.
This is a great role to take on the Lead Packaging Plating & Module Engineer role at Intel Corporation.
As a Lead Packaging Plating & Module Engineer, you will play an important part at Intel Corporation in OR, United States.
We invite applications for the Lead Packaging Plating & Module Engineer position located in OR, United States.
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