CAE Application Engineer; Structural, Thermal, RF​/SI-PI

Flexcompute(미국 보스턴 인근 본사)는 한국에서 근무할 CAE 애플리케이션 엔지니어(구조·열
· RF/SI-PI 해석)를 채용합니다. 반도체 및 첨단 패키징(2.5D/3D-IC, HBM) 분야가 중심입니다.

• 주요 업무: 고객사 BMT(벤치마크) 및 기술 평가 주도, 해석 셋업과 검증(구조해석, 열해석, 워피지, 전자파 해석, SI/PI 해석), 한국어 기술 교육과 워크숍
• 자격 요건: 구조, 열, RF/전자파 중 한 분야 이상의 실무 해석 경험, 유창한 한국어와 업무 가능한 영어, 비자 스폰서십 없이 한국 내 근무 가능
• 근무 형태: 독립 계약자(프리랜서) 계약, 한국 내 원격 근무(한국 사무소 없음), 정기적인 고객사 방문
• 지원 방법: 영문 이력서 제출. 사진, 생년월일, 혼인 여부, 가족 사항은 기재하지 마세요. 면접은 영어로, 화상으로 진행됩니다.

We are looking for exceptional engineers and physicists in Korea who want to apply first-principles thinking to the structural, thermal, and RF challenges behind the next generation of chips, electronics, vehicles, and aircraft.

We welcome outstanding people at different career stages, from PhD graduates with strong applied simulation work to senior industry engineers. If you want to learn fast, work with unusually strong scientists and engineers, and see your work shape real design decisions at leading companies, Flexcompute offers a rare environment in which to grow and do your best work.

Flexcompute is the physics company. We exist to make the real world computable. Created by engineers from MIT and Stanford, we build trusted, GPU-native physics simulation and AI-powered engineering technology for teams designing aircraft, vehicles, chips, and photonic systems. Our technology is used by more than 250 companies and academic institutions, including innovators such as Anduril, BETA Technologies, Coherent, Hermeus, Joby Aviation, Northrop Grumman, Samsung, and Xanadu.

Our products span fluid dynamics, electromagnetics, photonics, geometry, and multiphysics workflows. We work at the frontier of physical modeling, numerical algorithms, GPU computing, high-performance computing, AI, and engineering automation. The goal is not speed at the expense of physics. It is to make previously impractical, high-fidelity engineering work fast enough to shape real design decisions.

You will work with engineering teams at customers in Korea on hard structural, thermal, and RF problems. Some of the Flexcompute technology you will use is mature and in daily production use. Some of it is new, and you will help shape it: benchmarking it against established tools on real customer problems, finding where it needs to improve, and turning what customers need into product requirements.

You will focus on one or more of these domains:

• Structural mechanics: thermal stress, warpage, CTE mismatch, and the reliability of packages, boards, and assemblies.
• Thermal: heat transfer in chips, packages, and boards, from device-level hot spots to package-level temperature maps.
• RF and electromagnetics: antenna and microwave design, S-parameter extraction for interconnects, packages, and boards, and signal and power integrity.

Much of this work sits in semiconductors and advanced packaging, where structural, thermal, and electrical effects are coupled. Experience in one domain, plus curiosity about the others, is the right starting point.

• Understand challenging industrial problems, identify the relevant physics, and formulate an appropriate simulation strategy.
• Build, run, validate, and interpret simulations, and compare results with measurements, reference data, or established tools.
• Lead technical evaluations and benchmarks with customers in Korea, from problem definition to final results.
• Put new Flexcompute solvers through demanding customer cases before wider release, and report clearly where they match, beat, or fall short of established tools.
• Investigate unexpected results, convergence behavior, modeling assumptions, boundary conditions, mesh sensitivity, and discrepancies with experiments.
• Create clear and reusable Python workflows, examples, benchmarks, and…