Solder Specialist

We are seeking a detail-oriented and highly skilled Solder Rework Operator to perform precision soldering, rework, and repair of Printed Circuit Board Assemblies (PCBA). The ideal candidate will be trained to applicable industry standards and have hands-on experience with Ball Grid Array (BGA) rework and replacement, ensuring assemblies meet stringent quality and reliability requirements.

Perform manual soldering, desoldering, and rework of surface-mount and through-hole components in accordance with IPC and company standards.

Execute BGA rework and replacement, including:

Component removal using controlled heating methods.

Pad preparation and site cleaning.

Reballing and reinstallation of BGAs.

Profiling and inspection to ensure solder joint integrity.

Apply rework standards for solder joints, ensuring compliance with IPC-7711/7721 and IPC-A-610.

SMT (Surface Mount Technology) pad repairing damaged pads on a printed circuit board (PCB) by cleaning the area, removing the defective pad, and installing a new one using soldering and bonding techniques.

Conduct inspection and verification of reworked assemblies using AOI, X-ray, and magnification tools.

Support troubleshooting of soldering defects and collaborate with engineering teams to resolve issues.

Maintain accurate documentation of rework activities, including defect logs and corrective actions.

Follow ESD handling procedures and ensure compliance with safety and quality protocols.

Assist in training junior operators on soldering and rework techniques.

Education/Training:
High school diploma or equivalent; formal training in soldering and rework techniques.

Certifications:

IPC-A-610, J-STD-001, and IPC-7711/7721 certification strongly preferred.

Minimum 3-5 years of hands-on soldering and rework experience in PCBA manufacturing.

Proven expertise in BGA rework and replacement processes.

Skilled in soldering fine-pitch components, QFNs, BGAs, and other advanced packages.

Strong knowledge of soldering materials, fluxes, and rework equipment.

Familiarity with thermal profiling and controlled heating methods for rework.

Ability to read and interpret assembly drawings, work instructions, and technical documentation.

Excellent attention to detail and manual dexterity.

Strong problem-solving skills and ability to work independently or in a team environment.

Experience with X-ray inspection systems for BGA verification.

Knowledge of conformal coating removal and reapplication during rework.

Familiarity with selective soldering and vapor phase reflow processes.

Understanding of root cause analysis and corrective/preventive action (CAPA) in soldering defects.