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5D Packaging Engineer – HPC Systems Lead

Job in San Diego, San Diego County, California, 92189, USA
Listing for: Qualcomm
Full Time position
Listed on 2025-12-03
Job specializations:
  • Engineering
    Systems Engineer
Salary/Wage Range or Industry Benchmark: 154000 - 231000 USD Yearly USD 154000.00 231000.00 YEAR
Job Description & How to Apply Below
Position: 2.5D Packaging Engineer – HPC Systems Lead
A leading technology company in California is seeking a highly skilled individual to develop advanced 2.5D packaging technologies. The ideal candidate will have extensive experience in package technology development and the ability to lead cross-functional teams. Qualifications include a relevant bachelor's degree and significant industry experience. A competitive salary range of $154,000 - $231,000, along with robust benefits, is offered.
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