Semiconductor Packaging Engineer, Senior Staff Engineer

Company:
Qualcomm Semiconductor Limited Job Area:
Engineering Group, Engineering Group >
Packaging Engineering Qualcomm Overview

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5

Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

Qualcomm Packaging group is responsible for developing new package technologies and high volume manufacturing deployment for different product segments for mobile market & new emerging markets. This team is responsible for road mapping, working with OSATs, suppliers, internal design and cross-functional teams. Team is looking for experienced packaging engineer who has developed various packaging technologies Flipchip, CSP (Chip-Scale Package), PoP (Package-on-Package), SiP (System in Package), Module package.

etc. Some management and integration lead experience will be a plus.

• Responsible for exploring, development and HVM deployment of FCCSP, FCBGA, PoP and/or SiP/Module and RDL packaging technologies.
• Responsible for initiating & defining package process flow, material set/ BKM, test vehicle, DOEs & cornering, process control plans to successfully develop manufacturable and reliable products.
• Interface with OSATs, substrate/ material suppliers, and tool makers in developing technology related to product requirements. Align with internal product teams on Design Rule and its establishment.
• Associate with internal design team and drive DFM methodology for new technologies.
• Work with internal design, modeling and procurement teams to implement technically best and lowest cost packaging.
• Technical program management to plan, execute, and monitor complex processes or product developments. Regular updates on program status to management and share with cross team members.
• Good knowledge and understanding of SPC/QC concepts, failure mechanism and failure analysis process techniques, manufacturing floor operations and Quality issue handling.

• 10+ yrs of experience working in a fast-paced semiconductor packaging environment for consumer products.
• IC package development experience in – FC-CSP and/or FC-BGA and/or PoP and/or SiP/module and/or RDL Packages (CoWoS).
• Assembly or wafer bumping and Fan-out RDL process experiences, such as Die Preparation, flipchip attach, Underfill, Molding, SMT, Photo, Plating, and other key packaging process and material technologies.

• Experience in working with OSATs or major foundry packaging teams.
• Process integration experience in taking semiconductor packaging products from development to HVM.
• Experience with packaging assembly manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard component, component & board level reliability testing.
• Good understanding in CPI(Chip Package Interaction) and package reliability.

• Required:
  
  Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, related degree or equivalent practical experience.
• Preferred:
  Master’s degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, related Engineering field.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm will provide reasonable accommodations to support participation in the hiring process. Please contact Qualcomm Careers for more information.