SIPI Engineer, Sr

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group  Packaging Engineering General

Summary:

The Qualcomm CHS (Central Hardware System) has exciting opportunities in the areas of signal integrity and power integrity in next generation server project. The candidate will work with IC, Package and PBC designers to find ways to optimize the overall System performance. The candidate’s first responsibility is working with substrate designers to make sure all system level constraints are met prior to the package Tape-out.

The candidate is expected to communicate with PHY owners to understand the Specs for various IPs such as LP6, PCIe, 224G, etc, and also with PCB designers to assess the impact of Ball assignment to the system level performance. This position offers the opportunity to work across multiple organizations such as IP, PKG & PCB design and simulation teams.

The responsibilities will include but not be limited to the following:
• Perform package extraction for the time domain and frequency domain analysis
• Perform system-level analysis for DDR, Ser Des & PDN analysis
• Develop design guidelines for Package and PCB design
• Create technical documentation and presentations

Preferred Qualifications:

• 3+ years of experience in DDR/Ser Des in Package/PCB/System Design related to compute, Auto and/or Server projects
• Experience in Electromagnetics and solid background on transmission line theory & Crosstalk
• Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI and Clarity
• Experience in simulation tools such as ADS and Hspice
• Working knowledge in Cadence Allegro/APD/Sip or Mentor Xpedition
• Experience in utilizing AI to gain efficiency is a strong plus.
• Experience in Matlab
• Experience in design specifications such as LPDDRx, PCIe, Xlink
• Master Degree with 3 ~ 4 years of experiences is preferred, Ph.D with minimal experience is considered as well

Minimum Qualifications:

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.

ORMaster's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.

ORPhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disabili or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process.

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