IC Packaging FEA Engineer — Warpage, CPI & Reliability
Listed on 2026-10-07
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Engineering
Systems Engineer, Packaging Engineer, Mechanical Engineer
Qualcomm in San Diego seeks a Senior IC Packaging FEA Engineer to develop mechanical models (ANSYS APDL/Workbench) and perform warpage and reliability analyses for next‑generation package designs. You will build robust simulations that guide design and test correlation.
You will collaborate with design, NPI and CPI teams, characterize materials, develop BKMs, and drive test correlation while supporting manufacturing and reliability goals. Occasional travel may be required.
The IC Packaging FEA Engineer — Warpage, CPI & Reliability position in the Engineering field is open for applications.
This is a great position to take on the IC Packaging FEA Engineer — Warpage, CPI & Reliability role at Qualcomm.
As a IC Packaging FEA Engineer — Warpage, CPI & Reliability, you will play an important part at Qualcomm in San Diego, CA, United States.
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