RF Packaging Design Engineer mm-Wave ICs
Listed on 2026-10-07
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Engineering
Packaging Engineer, Electronics Engineer
Amazon is seeking an IC Packaging Design Engineer for its Leo initiative to design power-optimized packaging for mm-wave SoCs and front-end modules in a high-performance environment.
You will collaborate with cross-disciplinary teams and vendors, drive floor planning, and run 3D EM simulations to ensure optimal performance and reliability of complex packages. The role emphasizes cross-functional teamwork and innovation.
As a RF Packaging Design Engineer for mm-Wave ICs, you will play an important part at Amazon in San Diego, CA, United States.
This role, RF Packaging Design Engineer for mm-Wave ICs at Amazon, could be your next opportunity.
Are you ready to take on the RF Packaging Design Engineer for mm-Wave ICs role at Amazon?
We would love to welcome a new RF Packaging Design Engineer for mm-Wave ICs to our team in San Diego, CA, United States.
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