Senior Process Engineer: Flip Chip & 3D Packaging | Equity
Listed on 2026-10-11
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Engineering
Process Engineer, Manufacturing Engineer, Quality Engineering
Langham Recruitment in San Diego, CA is seeking a Senior Process Engineer to drive advanced packaging and manufacturing processes for photonics technologies. You will lead Flip Chip and Thermo-Compression Bonding efforts, support 2.5D/3D integration, and collaborate with suppliers to scale processes in a fast-growing environment.
You should bring 5+ years in manufacturing, deep expertise in Flip Chip/TCB, and strong skills in DOE, Gage R&R and statistical methods.
Join us at Langham Recruitment as our next Senior Process Engineer:
Flip Chip & 3D Packaging | Equity in San Diego, CA, United States.
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The position is based in San Diego, CA, United States.
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