Lead Thermal Architect, Server Packaging
Listed on 2026-10-15
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Engineering
Systems Engineer, Packaging Engineer
Qualcomm Technologies, Inc. seeks a Sr Staff or Principal Thermal Engineer to lead advanced thermal solutions for server packaging in San Diego. You will drive CFD studies, automate modeling tools, and oversee tests from die to ambient while coordinating with cross-functional teams.
The role requires 10+ years in electronics cooling for servers, with expertise in TIMs, heat sinks, vapor chambers, and 2.5/3D packaging. Strong communication and presentation skills are essential.
As a Lead Thermal Architect, Server Packaging, you will play an important part at QUALCOMM, Inc. in San Diego, CA, United States.
This role, Lead Thermal Architect, Server Packaging at QUALCOMM, Inc., could be your next career step.
Are you ready to take on the Lead Thermal Architect, Server Packaging role at QUALCOMM, Inc.?
We would love to welcome a new Lead Thermal Architect, Server Packaging to our group in San Diego, CA, United States.
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