Director of IC Packaging Simulation & Mechanical Analysis
Listed on 2026-10-15
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Engineering
Packaging Engineer, Mechanical Engineer
Qualcomm Technologies, Inc. seeks a Director of IC Packaging Engineering, Mechanical Simulation, in San Diego to lead a team delivering FEA-based simulation for next-gen chipsets and packaging technologies.
You will align IC package design, NPI, assembly, and CPI teams, drive innovation in workflows, and mentor engineers while shaping strategy and performance targets across HVM programs.
This is a great position to take on the Director of IC Packaging Simulation & Mechanical Analysis role at QUALCOMM, Inc.
We would love to welcome a new Director of IC Packaging Simulation & Mechanical Analysis to our group in San Diego, CA, United States.
For the Director of IC Packaging Simulation & Mechanical Analysis position at QUALCOMM, Inc., we are reviewing applications now.
Step into the Director of IC Packaging Simulation & Mechanical Analysis role at QUALCOMM, Inc. in San Diego, CA, United States and grow with us.
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