RF Packaging Design Engineer - mm-Wave ICs & AI-Driven
Listed on 2026-10-15
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Engineering
Packaging Engineer, Electronics Engineer
Amazon Leo is seeking an experienced IC Packaging Design Engineer in San Diego to lead power-optimized package solutions for mm-wave beamforming ICs and front-end modules. You will collaborate with cross-functional teams, suppliers, and RF designers to define floor plans, materials, and thermal strategies.
The role emphasizes AI-driven packaging workflows, advanced RF knowledge, and proven production-ready packaging expertise in high-performance chips.
The RF Packaging Design Engineer - mm-Wave ICs & AI-Driven position in the Engineering field is open for applications.
For the RF Packaging Design Engineer - mm-Wave ICs & AI-Driven position at Amazon Kuiper Manufacturing Enterprises LLC, we are reviewing applications now.
Step into the RF Packaging Design Engineer - mm-Wave ICs & AI-Driven role at Amazon Kuiper Manufacturing Enterprises LLC in San Diego, CA, United States and grow with us.
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