Failure Analysis Engineer - Advanced Packaging
Listed on 2026-10-17
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Engineering
Quality Engineering, Electronics Engineer, Systems Engineer, Test Engineer
Qualcomm Technologies, Inc. is seeking a Staff Failure Analysis Engineer to lead FA test interface enablement, advanced socketing, and thermal management across mobile, compute, and automotive platforms.
You will partner with Design, Yield, Reliability and external suppliers to define hardware specs, deploy socketing solutions, and drive robust fault isolation for high-pin packages and large systems.
We invite applications for the Staff Failure Analysis Engineer - Advanced Packaging position located in San Diego, CA, United States.
All applications are reviewed carefully by our team.
The position is based in San Diego, CA, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 135..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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