IC Packaging Design Engineer, Amazon Leo

Job Description:

Amazon Leo is launching a constellation of Low Earth Orbit satellites to provide high-speed broadband connectivity to underserved communities globally. We are seeking an IC Packaging Design Engineer to join our innovative team.

Responsibilities:

• Collaborate with digital design and RF chip designers to define floor plans, bump maps, and ball maps for beamforming ICs.
• Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design.
• Analyze cost/performance trade-offs and complete layout of package types such as FCBGA, FCCSP, WLCSP, QFN, etc.
• Setup and run 3D electromagnetic simulations of package + PCB using tools like HFSS and Momentum to verify designs.
• Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling.
• Assist the thermal team in defining and running thermal simulations of packages and PCBs.
• Collaborate with Antenna and EE teams to design and layout test and application PCBs for packages.
• Advise on qualification of packages: HAST, HTOL, board level reliability, etc.
• Define and implement AI-driven workflows for packaging design, leveraging automation and machine learning.

Qualifications:

• Bachelor's degree in Electrical Engineering or a related field.
• 5+ years of experience in RF design, preferably in an advanced node.
• Proven track record where products have gone to volume production.
• Experience with RF communication systems.

Skills:

• Master's degree in Electrical or Communications Engineering or a related field (preferred).
• 7+ years of experience designing full-custom packages/PCBs for high performance chips (preferred).
• Strong understanding of RF fundamentals such as s-parameters, impedance matching, and passive components.
• Strong understanding of power integrity fundamentals, including selection and optimization of passives in package.
• Experience routing high-speed, high pin count digital and analog interfaces (e.g., SERDES, CPU, memory).
• Understanding of package materials properties related to high-volume production and reliability.