Sr. Director - Engineering

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group  Mobile Chipset PE, MDM & MSMGeneral

Summary:

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Application Processor/Modem Chipset Engineer, you will plan and execute state-of-the-art chipsets through all phases from concept to commercialization across all engineering teams. Qualcomm Engineers collaborate with cross-functional teams to ensure delivery of hardware, software, test, documentation, and tools to enable on-time launch of customer devices in the market.

Minimum Qualifications:

• Bachelor's degree in Electrical Engineering, Computer Science, Computer Engineering, or related field and 10+ years of Electrical, Computer, or Software Engineering or related work experience.

ORMaster's degree in Electrical Engineering, Computer Science, Computer Engineering, or related field and 9+ years of Electrical, Computer, or Software Engineering or related work experience.

ORPhD in Electrical Engineering, Computer Science, Computer Engineering, or related field and 8+ years of Electrical, Computer, or Software Engineering or related work experience.
• 10+ years of experience in one or more areas of semiconductor product development.
• 5+ years in a technical leadership role.

Preferred Qualifications:

• Master's Degree or Ph.D. in Electrical Engineering, Computer Engineering, Computer Science, or related field.
• 15+ years of experience in one or more areas of semiconductor product development (e.g., system design, architecture, HW design and validation, SW development).
• 5+ years of experience balancing tradeoffs between product KPIs and costs.
• 5+ years of experience managing project costs.
• 4 + years of experience working in a large matrixed organization.
• 3+ years of work experience in a role requiring interaction with executive leadership.

Principal Duties and Responsibilities:

• Leverages expert knowledge of Application Processor/Modem chipsets to influence and oversee chipset development and ensures chips are performing the functions of a device (e.g., Application Processor, Modem, PMICs, Connectivity chips, Transceivers, and RF front end components) and associated Software/Firmware.
• Oversees the resolution of all engineering issues on the chipset whether within a specific subsystem, or across subsystems, functions, and chipset components.
• Outlines schedules, costs, requirements, and KPIs (e.g., power, performance, reliability) from concept to commercialization.
• Influences development of new methodology for verification of KPIs (performance, power, and quality) of all components across the chipset; provides technical oversight to teams conducting hardware, software, or systems-level testing, verification, and validation to ensure project plans and specifications are met.
• Sets guidelines for writing detailed technical documentation and feature descriptions; writes and reviews documentation.

Level of Responsibility:
• Provides supervision to other supervisors/managers who are direct reports.
• Decision-making is critical in nature and highly impacts program, product, or project success.
• Requires verbal and written communication skills to convey highly complex and/or detailed information. May require strong negotiation and influence with large groups or high-level constituents.
• Develops and administers budgets, schedules, and performance standards for functional area within the prescribed budgetary objectives of the department.
• Has influence over the formulation and achievement of long-term business plans and objectives.
• Tasks often require…