Senior Package Design Engineer - SoC, SiP & 3D Packaging
Listed on 2026-11-06
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Engineering
Packaging Engineer, Mechanical Engineer, Manufacturing Engineer
Qualcomm Technologies, Inc. is seeking an experienced Staff Package Design Engineer in San Diego to own advanced package selection and SI/PI optimization.
You will drive SoC packaging, work with multi-disciplinary teams to optimize mechanical, electrical, and thermal performance, and shape verification flows. The role requires a Master's in a related field with 5+ years of experience, familiarity with Cadence Allegro and various packaging configurations, and a strong background in high-speed
We are seeking a motivated Senior Package Design Engineer
- SoC, SiP & 3D Packaging to join QUALCOMM, Inc. in San Diego, CA, United States.
Consider building your career as a Senior Package Design Engineer
- SoC, SiP & 3D Packaging at QUALCOMM, Inc.
The Senior Package Design Engineer
- SoC, SiP & 3D Packaging position in the Engineering field is open for applications.
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