Thermal Engineer

## Company:
Qualcomm Technologies, Inc.

## Job Area:
Engineering Group, Engineering Group >
Packaging Engineering

Qualcomm’s Hardware System is seeking a talented Thermal Engineer to contribute to continued success of our industry-leading portfolio of chipset solutions. The qualified individual will be contributing to innovative solutions resolving complex thermal mgmt. challenges within Automotive space. Such individual should have in-depth understanding of heat transfer fundamentals and be an expert in electronics cooling of Automotive modules. He/she must be experienced in creating analytical and numerical models utilizing CFD tools.

In addition, experience in conducting thermal experiments in support of various product development efforts is a must. Further, intimate knowledge of thermal mgmt. materials and their applications to enhance hardware thermal performance is required.

• Support thermal/mechanical projects from concept to production phase.
• Design, set up, run, and deliver results for various thermal experiments.
• Conduct test or research on materials and thermal solutions.
• Manage technical projects across organization.
• Perform thermal simulations utilizing CFD tools for product-level solutions and present results.

• Skillset and hands-on experience to enable test hardware/platforms and execute test vectors for the purpose of thermal validation and verification testing.
• Ability to write scripts and data analysis.
• Programming experience with Python, C/C++.
• Debugging and bring up experience with test platforms required.
• Ability to design thermal tests and execute per plan within a laboratory environment.
• 5+ years of industry experience in electronics cooling preferably related to Automotive applications.
• Thorough understanding of cooling techniques for electronic components and equipment.
• In-depth understanding of natural, forced convection cooling and liquid cooling. Exposure to cooling systems related to Automotive industry is a plus.
• Must have design experience with PCBs, component placement, enclosures, and heat sinks.
• Expertise in conducting CFD simulations utilizing tools such as ANSYS-Icepak or Flotherm.
• Some experience with 3D geometry CAD tools such as Solidworks or Pro/ENGINEER.
• Experience operating data acquisition equipment.
• Excellent communication skills.

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disabili or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process.

Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

EEO

Employer:

Qualcomm is an equal opportunity employer; all…