Principal TPM: Hardware Chiplet Tape- Lead

Annapurna Labs, part of Amazon, is seeking a Principal Technical Program Manager to own end-to-end program execution for a mult-die ML accelerator chip—from RTL freeze through tape-out and into production readiness. You will align multiple engineering streams into a single schedule and drive critical-path decisions with cross-functional partners.

You will lead weekly status cadences, track verification convergence, manage external design partners, and ensure infrastructure readiness and IP

Join us at Annapurna Labs as our next Principal TPM:
Hardware Chiplet Tape-Out Lead in San Diego, CA, United States.

Please review the full job details above before applying.

If your experience matches this role, we encourage you to apply.

All applications are reviewed carefully by our team.

The position is based in San Diego, CA, United States.

This opportunity is part of our work in Management & Operations, IT & Technology.