Summer Software Engineer Intern — Shape -Gen Wireless
Listed on 2026-10-15
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Software Development
Embedded Systems/ Firmware/ IoT, C++ Developer, Software Engineer, Python
Qualcomm Technologies, Inc. is seeking a Software Engineering Intern for Summer 2027 in San Diego, CA. You will contribute to real-world software projects across wireless and computing platforms, collaborating with world-class engineers to design, implement and debug software.
Candidates must be enrolled in CS/CE/EE and available for 11–14 weeks in May–September 2027, with strong programming experience in C/C++ or Python. Prior OO design and multi-threading exposure are a plus.
As a Summer Software Engineer Intern — Shape Next-Gen Wireless, you will play an important part at QUALCOMM, Inc. in San Diego, CA, United States.
We are currently recruiting a Summer Software Engineer Intern — Shape Next-Gen Wireless for our team in San Diego, CA, United States.
This is a great position to take on the Summer Software Engineer Intern — Shape Next-Gen Wireless role at QUALCOMM, Inc.
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