Sr. Silicon & Systems Engineer

Job :| Amazon Innovation Center (Shenzhen) Company Limited Shanghai Branch

Amazon Devices is an inventive research and development company that designs and develops high‑profile devices like the Kindle family of products, Fire Tablets, Alexa, Fire TV, Health Wellness, Amazon Echo & Astro products. This is an exciting opportunity to join Amazon in contributing to its next generation SOC’s for the machine learning enabled consumer products.

Key Job Responsibilities

• Drive RCA activities for failures pointing to silicon, in development and production phases of the product by collaborating with multi‑functional teams.

• Develop and drive qualification activities for peripheral parts like memories and storage based on customer (product team) requirements.

• Support product teams with appropriate design collateral. Update and maintain the design collateral as needed. Offer timely design reviews from a silicon standpoint.

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Risk Management:

Drive containment, risk assessment and mitigation activities related to silicon/hardware failures.

• Craft integration/debug strategy for new HW features in system level, including specifications, validation plans, debug methodology as needed, across (but not limited to) Validation and ATE environments.

Basic Qualifications

• Bachelor's degree in Electrical Engineering or a related field.

• Extensive experience in the Semiconductor industry.

• Good understanding of ARM V8/V9 Architecture, familiar with multimedia SoC key hardware features.

• Experience with system engineering, expertise in Linux OS low layer interactive with the silicon and related debugging methodology.

• Experience with SoC bring‑up and post‑silicon validation.

• Experience leading technical initiatives and key deliverables.

• Experience working with software teams to tightly define the HW/SW interface.

Preferred Qualifications

• Master's degree or Ph.D. in Electrical Engineering or related field.

• Experience developing products for volume production and resolving issues that happen in mass production phase.

• Experience in bare‑metal environment development, including linker scripts, page tables and NVIC.

• Experience in high‑speed interface (DDR, HDMI, EMMC, USB, PCIe) specification and enabling/debugging.

• Experience in practical semiconductor design work, including full‑chip and subsystem integration.

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Posted: November 17,Updated 1 day ago)

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