Lead SoC Substrate Engineer – Global
Listed on 2026-10-07
-
Engineering
Quality Engineering, Packaging Engineer, Systems Engineer
Apple Inc. in San Francisco Bay Area is seeking a lead for substrate technology development within the packaging team.
The role focuses on owning package substrate technology development, from concept to HVM, and driving architecture optimization across cross-functional groups to achieve best performance and reliability. Lead efforts include collaboration with foundries and OSAT, 5% international travel, and defining roadmaps for future substrate solutions.
For the Lead SoC Package Substrate Engineer – Global Travel position at Apple Inc., we are reviewing applications now.
We would love to welcome a new Lead SoC Package Substrate Engineer – Global Travel to our group in San Francisco, CA, United States.
Step into the Lead SoC Package Substrate Engineer – Global Travel role at Apple Inc. in San Francisco, CA, United States and grow with us.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).