Chiplet SI/PI Engineer: Packaging & Interconnects
Listed on 2026-10-07
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Engineering
Packaging Engineer, Systems Engineer, Electrical Engineering, Electronics Engineer
Eliyan Corporation in San Francisco is seeking a Signal and Power Integrity Engineer to develop packaging solutions for chiplet interconnects. This role involves working with a cross-functional team and leading simulation efforts for advanced packaging technologies.
The ideal candidate will have a BS in EE, 5 years of experience in signal and power integrity, and be proficient with various simulation tools. Eliyan offers an exciting work environment and excellent benefits.
Are you ready to take on the Chiplet SI/PI Engineer:
Packaging & Interconnects role at Eliyan Corporation?
The advertised compensation is 120..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Chiplet SI/PI Engineer:
Packaging & Interconnects role in the description above.
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