COL-| Principal Laser Packaging Engineer

San Francisco Bay Area, United States | Posted on 10/07/2026

Colwyn Group is a staffing and recruiting firm headquartered in Austin, Texas, working across healthcare, technology, and executive search. We place candidates with employers across the US.An American Staffing Association member firm.

Principal Laser Packaging Engineer

Location:

San Francisco Bay Area, CA (Berkeley / Hybrid)
Industry: Deep Tech / Photonics & Semiconductors

Employment Type:

Full-Time Compensation: $135,000 – $165,000 / year base salary + competitive equity package

Position Overview We are seeking an experienced Principal Laser Packaging Engineer for a venture-backed deep tech startup developing and commercializing next-generation, high-power photonic crystal surface-emitting lasers (PCSELs).In this role, you will take full ownership of the laser module packaging architecture, guiding high-power laser dies from initial concept to a fully manufacturable, taped-out package. You will be directly responsible for the thermal architecture, die-attach and bonding strategy, and hardware integration to ensure devices meet rigorous wavelength, efficiency, and reliability specifications through assembly and characterization.

Key Responsibilities Lead and own the complete laser package architecture from conceptual design through tape-out.

Architect and optimize the thermal path, including die-attach, submount selection, heat-spreader design, and active/passive cooling integration.

Translate target electro-optical performance metrics into a robust, manufacturable package that maintains emission wavelength stability and optical efficiency across dynamic operating conditions.

Perform thermal and mechanical modeling/simulations and correlate results with empirical data (junction temperature, wavelength drift, and thermal rollover).Rapidly troubleshoot, debug, and iterate packaging solutions in an agile, high-growth startup environment.

Candidate Qualifications

Education:

Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, Optical Engineering, or a related field.

Packaging

Experience:

Proven track record in optoelectronic or laser packaging, with specific hands-on experience packaging high-power continuous-wave (CW) semiconductor lasers.

Full-Lifecycle Delivery:
Demonstrated success bringing semiconductor laser dies from early concept to a taped-out, reliable, and manufacturable package.

Thermal & Physics Acumen:
Strong fundamental understanding of how thermo-mechanical dynamics influence semiconductor laser performance and device lifetime.

Problem-Solving & Communication:
Self-directed mindset comfortable with ambiguity in an early-stage startup environment, paired with strong technical writing and collaborative communication skills.