Lead Laser Packaging Engineer Power PCSELs; Hybrid
Listed on 2026-10-13
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Engineering
Packaging Engineer
Colwyn Group is actively seeking a Principal Laser Packaging Engineer in the San Francisco Bay Area, CA. The role centers on owning the laser package architecture for high-power PCSELs, guiding dies from concept to manufacturable, taped-out packages.
Responsibilities include thermal path design, die-attach strategy, and hardware integration to meet stringent performance specs. Requires experience in optoelectronic packaging and strong thermo-mechanical understanding for reliable device lifetime.
Are you ready to take on the Lead Laser Packaging Engineer – High-Power PCSELs (Hybrid) role at Colwyn Group?
The following opening is for a Lead Laser Packaging Engineer – High-Power PCSELs (Hybrid) with Colwyn Group.
Our team is growing, and we are hiring a Lead Laser Packaging Engineer – High-Power PCSELs (Hybrid) in San Francisco, CA, United States.
This opening is for the Lead Laser Packaging Engineer – High-Power PCSELs (Hybrid) role at Colwyn Group.
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