Chiplet SI/PI Engineer: Packaging & Interconnects
Listed on 2026-11-05
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Engineering
Packaging Engineer, Electrical Engineering, Electronics Engineer
Eliyan Corporation in San Francisco is seeking a Signal and Power Integrity Engineer to develop packaging solutions for chiplet interconnects. This role involves working with a cross-functional team and leading simulation efforts for advanced packaging technologies.
The ideal candidate will have a BS in EE, 5 years of experience in signal and power integrity, and be proficient with various simulation tools. Eliyan offers an exciting work environment and excellent benefits.
We are looking to fill the Chiplet SI/PI Engineer:
Packaging & Interconnects position at Eliyan Corporation in San Francisco, CA, United States.
The Chiplet SI/PI Engineer:
Packaging & Interconnects role at Eliyan Corporation is now open for applications in San Francisco, CA, United States.
Join us at Eliyan Corporation as our next Chiplet SI/PI Engineer:
Packaging & Interconnects in San Francisco, CA, United States.
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