Senior .5D/3D Packaging Architect HPC & Auto
Listed on 2026-10-13
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Design & Architecture
Computer Graphics / 3D / Animation
Media Tek Research Lab Inc. in San Jose is looking for an experienced Packaging Architect specializing in advanced semiconductor packaging technologies like 2.5D/3D/3.5D. This position involves collaboration with various teams to develop innovative packaging solutions for automotive and computing applications.
The ideal candidate should possess over eight years of hands-on experience and excellent communication skills. Competitive salary range is $171,000 to $272,000, plus benefits including health insurance and a 401(k).
As a Senior 2.5D/3D Packaging Architect for HPC & Auto, you will play an important part at Media Tek in San Jose, CA, United States.
This is an excellent opportunity to take on the Senior 2.5D/3D Packaging Architect for HPC & Auto role at Media Tek.
We invite applications for the Senior 2.5D/3D Packaging Architect for HPC & Auto position located in San Jose, CA, United States.
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