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Senior Substrate & DIC Packaging Engineer

Job in San Jose, Santa Clara County, California, 95199, USA
Listing for: TSMC - Taiwan Semiconductor Manufacturing Company Limited
Full Time position
Listed on 2025-12-22
Job specializations:
  • Engineering
    Systems Engineer, Manufacturing Engineer, Packaging Engineer
Salary/Wage Range or Industry Benchmark: 125000 - 150000 USD Yearly USD 125000.00 150000.00 YEAR
Job Description & How to Apply Below
Position: Senior Substrate & 3DIC Packaging Engineer
A leading semiconductor foundry in San Jose seeks a highly skilled Substrate / Advanced Package Engineer to innovate in 3

DIC design and packaging. Responsibilities include designing, simulating, and optimizing advanced packaging technologies while collaborating with cross-functional teams. Candidates should have a Master’s degree or Ph.D. in Engineering and over 15 years of relevant experience. The role promises significant impact within a cutting-edge environment focused on technological advancements.
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Position Requirements
10+ Years work experience
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