Principal Digital Engineer

Job Description

This is an opportunity to join Renesas Infrastructure and Mixed-Signal Division, Memory Interface Product Line. You will join the team to develop the next-generation device with an embedded processor subsystem and security function.

Renesas is looking for experienced Digital IC Design Engineering candidates that will be working on architecting/designing our embedded processor system, related peripheral IP, and mixed-signal design. The design scope includes embedded MCUs, volatile and non‑volatile memory, digital signal processing, security features, and industry‑standard bus interfaces. This position requires hands‑on experience with embedded processors and subsystems, and experience in driving spec, design, and chip implementation.

This includes but is not limited to MCU, peripheral IP, volatile/non‑volatile memory IP selection, partitioning of hardware/firmware, RTL design, verification, FPGA prototyping, DFT, and IC qualification.

• Chip architecture, design, and integration: MCU and peripherals, embedded flash and SRAM memory subsystem, on‑chip bus system, DMA and interrupt system
• Digital IP RTL design, simulation, and release
• Independently handle complicated design tasks or lead/drive multiple development efforts
• Chip level synthesis, timing check, DFT, and floorplan in a Mixed‑Signal Integrated Circuit
• HW/SW partitioning
• Work with firmware team and FPGA team on debugging and emulation
• Work with Product, Test, and Applications Engineering to complete product release
• Work in a multi‑site, multi‑culture development environment

• Master’s degree or equivalent in Electrical Engineering with a minimum of 10 years of relevant industry experience
• Hands‑on Knowledge and Experience with RISC‑V and ARM Cortex‑M series MCU subsystem
• Good Experience with architecting and integrating IP in digital logic design
• Hands‑on knowledge and good experience with Verilog/System Verilog for digital design and verification
• Hands‑on knowledge and good experience with Synthesis, Timing Check, and DFT design
• Must have experience in developing digital design in mixed‑signal chips that went to volume production
• Excellent oral and written communications skills, writing technical architecture and design documents, communicating with cross‑function team

• Circuit/Transistor level mixed‑signal design experience
• Embedded Flash controller‑related design experience
• Digital Security experiences – hash, symmetric and asymmetric encrypt ions, digital signature
• Digital Signal Processing
• FPGA mapping or digital design experience
• Interface technologies – USB, I3C
• Programming/scripting skills such as C/C++, Assembly, Python, etc.
• Firmware development experience
• Language fluency in Mandarin
• Design Lead or Project Lead experience

The expected annual pay range for this position is $190K-$240K. This position is also eligible for bonus opportunities and commission pay. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate.

Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre‑tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company‑paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation.

New employees will attend a detailed benefit orientation to learn more about our many benefits and resources.

Renesas is an embedded semiconductor solution provider driven by its Purpose ‘
To Make Our Lives Easier
.’ As the industry’s leading expert in embedded processing with unmatched quality and system‑level know‑how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.

With a diverse team of…