Lead R&D Engineer, Advanced Packaging AI & HPC
Listed on 2026-10-07
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Engineering
Packaging Engineer, Systems Engineer, Electronics Engineer, Product Engineer
Broadcom Inc. is seeking a Senior Technical Lead in San Jose, California, to oversee multi-chip semiconductor assembly and development of new technologies. The ideal candidate will have a strong background in advanced packaging and significant experience in semiconductor R&D and production.
The position offers a salary range of $167,500 to $268,000, a discretionary annual bonus, equity awards, and a comprehensive benefits package including medical and 401(k) matching.
The Lead R&D Engineer, Advanced Packaging for AI & HPC position in the Engineering field is open for applications.
For the Lead R&D Engineer, Advanced Packaging for AI & HPC position at Broadcom Inc., we are reviewing applications now.
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