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Thermal Design Engineer - Lead Principal

Job in San Jose, Santa Clara County, California, 95199, USA
Listing for: Infineon Technologies AG
Full Time position
Listed on 2026-10-27
Job specializations:
  • Engineering
    Mechanical Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 150000 - 190000 USD Yearly USD 150000.00 190000.00 YEAR
Job Description & How to Apply Below
  • Lead thermal design and development of advanced semiconductor power solutions, including IVR, VRM, and power module platforms
  • Architect thermal management solutions for high power-density products utilizing liquid cooling, cold plates, manifolds, heat sinks, and TIM materials
  • Perform detailed thermal simulations using ANSYS Icepak, FloTHERM, FEAtools, and CFD methodologies
  • Develop and optimize mechanical designs using Solid Works for thermal assemblies and packaging solutions.
  • Conduct steady-state and transient thermal analysis to improve performance, reliability, and manufacturability.
  • Evaluate and select thermal interface materials (TIMs), cooling technologies, and advanced materials for semiconductor applications.
  • Partner cross-functionally with electrical, package, reliability, manufacturing, and systems engineering teams.
  • Drive prototype builds, thermal validation, and correlation between simulation and lab data.
  • Mentor junior engineers and provide technical leadership across thermal engineering initiatives.
  • Influence product roadmap decisions related to thermal performance, packaging, and system integration.
  • Bachelor's or Master's degree in Mechanical Engineering or related discipline. PhD is a plus. 8-10+ years of thermal/mechanical design experience within the semiconductor, power electronics, or advanced electronics cooling industry.
  • Expert proficiency in Solid Works for 3D mechanical design.
  • Strong hands-on experience with FloTHERM, ANSYS Icepak, and Finite Element Analysis (FEA) tools.
  • Deep knowledge of liquid cooling systems, including cold plates,manifolds, pumps, and coolant flow optimization.
  • Experience designing heat sinks, vapor chambers, TIM interfaces, and package level thermal solutions.
  • Strong understanding of semiconductor packaging constraints,reliability, and manufacturability.
  • Ability to lead programs independently and communicate effectively with executive and technical teams.

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion.

We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience.

Even if you don't meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

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