Mechanical Engineer II - Hardware Packaging & Thermal Design
Listed on 2026-10-12
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Engineering
Mechanical Engineer, Packaging Engineer, Manufacturing Engineer, Systems Engineer
Cisco Systems, Inc. is seeking a Mechanical Engineer to collaborate with hardware design, ECAD, test assurance, and lead engineers. You will drive features from design feasibility to manufacturing, owning mechanical design, BOM management, and DFM optimizations.
You will perform tolerance stack-up analyses, reliability testing, and work with thermal engineers to refine heat sink and enclosure designs while ensuring cost-effective manufacturing processes.
We would love to welcome a new Mechanical Engineer II
- Hardware Packaging & Thermal Design to our group in San Jose, CA, United States.
This is a strong opportunity to take on the Mechanical Engineer II
- Hardware Packaging & Thermal Design role at Cisco Systems, Inc.
As a Mechanical Engineer II
- Hardware Packaging & Thermal Design, you will play an important part at Cisco Systems, Inc. in San Jose, CA, United States.
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