Technical Director, Packaging Engineering; AI

SiMa.ai is looking for a Technical Director of Packaging Engineering to drive High Performance FCBGA and SiP packaging technology development to support SiMa.ai MLSoCTM IC roadmap from package definition and design through qualification to mass production. This is a hands‑on technical leadership role with personal ownership of package design and SI/PI for high‑speed LPDDR and PCIe interfaces.

• Own package SI/PI hands‑on for high‑speed interfaces — LPDDR5x/6 DRAM and PCIe Gen5, plus 10G Ethernet and MIPI: chip–package–board co‑design, channel and PDN simulation (loss, crosstalk, eye margin, PDN impedance, IR drop), and lab correlation
• Lead and coordinate advanced package development activities from package definition (architecture, bump/ball map, substrate stack‑up, body size) and design to mass production, including all aspects of high density/high performance interconnects design, thermo‑mechanical (warpage, lid/stiffener, thermal), quality, reliability, cost, and yield constraints
• Definition and implementation of FCBGA and SiP packaging strategies for high‑speed complex mixed‑signal ICs in close collaboration with Design, Hardware, and Quality teams
• Drive OSAT and substrate supplier relationships: selection, technical and commercial negotiation, capacity, process and material qualification, PCN review, and yield/cost roadmaps
• Packaging NPI activities including characterization, qualification (JEDEC, AEC‑Q100, board‑level reliability) and productization at the right cost and quality for tier‑1 customers, including Automotive
• Package production control, issues resolution, yield/DPPM monitoring and improvement
• Support package RMA and FA activities, working closely with QA and Design teams
• Representing Packaging Engineering to SiMa.ai customers
• Build and lead a compact package design and SI/PI team as a player‑coach, personally reviewing layouts and simulation results
• Travel up to 10%

• BS/MS in Electrical Engineering, Mechanical Engineering, Material Science or a related field with 10+ years relevant experience in FCBGA/SiP package design and development
• Must have: hands‑on SI/PI design and simulation of high‑speed DRAM (LPDDR5x/6), PCIe (Gen5), UCIe channels and PDN at package and board level, using tools such as Ansys HFSS/SIwave, Cadence Sigrity/Clarity, or Keysight ADS, with lab correlation (VNA/TDR, eye measurements)
• Hands‑on package substrate design: bump/ball map, stack‑up, routing, and design‑rule trade‑offs with substrate vendors (Cadence APD+/SiP Layout or equivalent)
• SiP experience: multi‑die and SoC‑plus‑memory integration, passive integration, and the related assembly and test challenges
• Proven track record driving OSATs and substrate suppliers from package definition through qualification and mass production
• Automotive package qualification and NPI‑to‑mass‑production experience (AEC‑Q100, PPAP)
• Good understanding and hands‑on experience of all aspects of complex high‑speed mixed‑signal SoC High Performance FCBGA packaging development, cost and quality
• Proficiency with thermal, mechanical, reliability and cost trade‑offs in package design
• Experience with FCBGA failure mechanisms and failure analysis
• Experience with advanced substrate materials with low dielectric constant (Dk), low dielectric loss (Df), and low coefficient of thermal expansion (CTE) at high frequencies to solve problems such as transmission loss and package warpage
• Excellent verbal and written communication and presentation skills
• Fluent in…