Principal Mechanical Engineer

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Whether you’redesigning next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger— technology that moves the world forward.

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Join AMD's advanced packaging organization and help shape the mechanical architecture of next-generation high-performance computing, AI, and semiconductor products. As a Principal Mechanical Engineer, you will lead the development of advanced package-board-system mechanical solutions spanning concept definition, mechanical design, simulation, qualification, and manufacturing ramp. This is a highly visible technical leadership role that offers the opportunities to influence product direction, solve complex product challenges from package, server and rack system.

Daily work across core-development team from marketing, system architecture, HW & SW, reliability, and manufacturing to bring industry-leading technologies to market.

The ideal candidate brings the technical depth of a principal-level individual contributor, the judgment as a senior engineering leader, and the hands-on capability to personally drive product solution design, team reviews, supplier engagement, and problem resolution from concept through NPI, qualification, and production ramp. You enjoy solving complex problems, hand-on skills of advanced CAD design and thermal-mechanical FEA modelling tools, mentoring engineers, and driving execution across cross-functional teams.

This position is especially suited for top-tier talent from semiconductor, HPC server/system or AI cloud platform companies with strong experience in advanced packaging, mechanical design, mechanical stress simulation, and manufacturing execution who want to remain technically involved while also helping guide technology strategy, edged-chip cooling technology, engineering excellence, and future team growth.

• Perform and lead thermal-mechanical architecture and solution strategy for advanced semiconductor packaging solutions from SoC to system.
• Perform and drive thermal-mechanical design, thermo-mechanical analysis, and integrated solution development from concept through production.
• Perform and guide stress, warpage, reliability, and package-board interaction modeling using FEA tools.
• Partner with silicon, packaging, thermal, reliability, manufacturing, and supplier teams to optimize product performance and manufacturability.
• Drive Design for Manufacturability, Design for Assembly, tolerance analysis, FMEA, DVP&R, ECO governance, BOM cost review, and supplier management.
• Conduct and lead qualification, failure analysis, and root-cause investigations across NPI and production.
• Establish and control package mechanical specifications, design guidelines, product CAD models, simulation reports, assembly instructions, qualification documentation, and technical reports.

• Hands-on expertise with Creo, Solid Works, ANSYS Mechanical, and assembly tolerance analysis
• Profound mechanical design skills of the package, PCB, system-level robust solution with the high-power chip cooling integration.
• Proven track record in architecting and delivering advanced cooling solutions, including heatsinks, vapor chambers, heat pipes, and liquid cold plates, from concept and feasibility through DFM, prototyping, qualification, and high-volume manufacturing (HVM).
• Demonstrated experience with cooling…