Technical Director, -Speed Packaging & SiP
Listed on 2026-10-16
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Engineering
Packaging Engineer, Quality Engineering
SiMa.ai, Inc. seeks a Technical Director of Packaging Engineering in San Jose, CA to lead high-speed packaging development for LPDDR5x/6, PCIe Gen5, and related interfaces.
You will own SI/PI design, lab correlation, and supplier relationships, driving architecture through mass production with a focus on cost, quality, and reliability. The role requires hands-on experience with advanced substrates, 2.5D/Chiplet concepts, and cross-functional leadership across Design, Hardware, and QA teams.
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Join us , Inc. as our next Technical Director, High-Speed Packaging & SiP in San Jose, CA, United States.
We are currently recruiting a Technical Director, High-Speed Packaging & SiP for our team in San Jose, CA, United States.
This is an excellent opportunity to take on the Technical Director, High-Speed Packaging & SiP role , Inc.
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